A Message from Our CEO
Dear customers and partners worldwide,
The semiconductor industry demands ever-tighter tolerances and ever-higher throughput from every component in the process chain. At Saehan Nanotech, we focus on solving the machining challenges at the front of that chain — the precision-drilled consumable components that keep etch, CVD, and ALD chambers running.
Our patented Both-Side Spindle Drilling Machine (ANT-BSSD500) was born from a direct observation: the workpiece reversal step in conventional electrode drilling is the single largest source of concentricity defects. By drilling both faces simultaneously, we eliminate that error at its source. The result is a machine that consistently holds 20μm concentricity — with 2-3× the throughput of vertical alternatives.
Alongside our drilling technology, our multi-wire and single-wire diamond wire saws give customers a complete solution for slicing hard brittle semiconductor materials — from monocrystalline silicon to SiC, sapphire, quartz, and ALN — with industry-leading kerf loss performance.
Every machine we ship carries a commitment: if it leaves our factory, it meets spec. We back that with hands-on training and responsive after-sales service, because we know that downtime in semiconductor manufacturing is measured in dollars per minute.
We look forward to being your precision machining partner.