Single Wire Sawing Machine
Precision cutting of hard and brittle materials including Si, SiC, Quartz, and Graphite using a diamond loop wire. Minimizes kerf width while maximizing cut quality, delivering the optimal cutting solution for your process with enhanced stability.
Change cutting thickness between runs without re-wiring. Adjust roller spacing and recipe parameters — unique advantage for diverse materials and custom specifications.
Single wire enables precise control of tension and cutting force — less force variation means better surface quality and less downstream polishing.
One machine handles silicon, SiC, sapphire, quartz, graphite, NdFeB, SmCo, and engineering ceramics.
A more reliable choice for materials that demand precision cutting.
From semiconductor substrates to optical, specialty, and rare-earth materials — precision cutting solutions tailored to your process.
SEMICONDUCTOR
Precision cutting of high-hardness semiconductor ingots for high-quality wafer processing.
OPTICAL
Fracture-free precision cutting of brittle glass-type materials for optical component production.
SPECIALTY
Meeting diverse industry demands with industrial specialty material machining capability.
RARE EARTH
Precision cutting of NdFeB permanent magnets for EV motors and wind power applications.
Diamond loop wire is the heart of single-wire sawing performance. Particle density, bonding uniformity, and wire core quality directly determine cut surface finish, kerf consistency, and wire life. High-quality electroplated diamond wire produces exceptionally clean and smooth cut surfaces with minimal sub-surface damage — reducing downstream lapping and polishing.
We supply custom-spec diamond wire matched to each machine and process. Wire diameter (0.10–0.25 mm), particle size, and electroplating density are tuned to your workpiece’s hardness, brittleness, and target surface specification — not a one-size-fits-all consumable. Available bundled with the machine or as standalone replenishment.
Every ANT-SLWS machine is designed and manufactured to match your specific material, workpiece geometry, thickness requirements, and production volume. There is no fixed specification — we engineer the optimal machine for your process.
Frame structure, roller geometry, and wire path configured per workpiece size and material
Wire speed, tension, feed rate, and coolant parameters optimized for your material
Diamond loop wire diameter and abrasive grade selected for your specific cutting requirements
Contact us for technical specifications, machining test requests, or a custom quote.
