Complete precision machining solutions for semiconductor and hard brittle material manufacturing.
From patented both-side micro drilling to diamond wire sawing, precision grinding, step polishing, and nano imprinting — a complete solution for silicon, SiC, AlN, quartz, and advanced ceramic semiconductor components.
Patented simultaneous dual-spindle micro hole drilling. Concentricity ≤20㎛, L/D 30, 2-3× throughput.
Learn More →Diamond wire batch slicing for Si, SiC, Sapphire, NdFeB. Proprietary tilting/rotating technology.
Learn More →Freely adjustable thickness. Ideal for R&D and precision small-batch cutting.
Learn More →Multi-axis CNC grinding for surface, ID, and OD in a single setup.
Learn More →Cylindrical coring of Si, SiC, Sapphire ingots. Chipping-free entry/exit.
Learn More →Mirror-finish polishing for step, groove, and inclined surfaces. Ra < 1nm.
Learn More →Vertical-axis face grinding for large-diameter flat workpieces. Flatness < 1μm.
Learn More →UV/thermal nano-imprint lithography. Sub-100nm patterning for Nano-LED and semiconductor.
Learn More →Diamond multi wire sawing for NdFeB and other rare earth permanent magnets. Twin work tables, 2–5 roller configurations.
Learn More →Contact us for technical specifications, machining test requests, or a custom quote.
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