Saehan Nanotech Co., Ltd. has completed the contract and delivery of SiC (silicon carbide) processing equipment to a major US semiconductor company, marking the company's entry into the American market.

The delivered equipment includes a multi-wire diamond wire sawing machine configured specifically for precision slicing of SiC ingots into wafer substrates used in power semiconductor devices.

SiC power devices are critical components in electric vehicles, industrial power systems, and renewable energy infrastructure. The global SiC market has been growing rapidly as the automotive industry transitions to electric powertrains, driving demand for precision SiC wafer processing equipment.

This delivery establishes Saehan Nanotech's presence in the global SiC power device supply chain and demonstrates the company's capability to meet the quality and performance standards required by leading international semiconductor manufacturers.